“ADLINK’s Express-IBR is equipped with the 3rd generation Intel® Core™ processor, which utilizes Intel’s new 3D tri-gate transistor technology and 22nm process technology,” said Jeff Munch, CTO of ADLINK Technology and chair of the COM Express COM.0 R2.1 Sub-committee.
Following ADLINK's Rugged By Design methodology, the Express-IBR is ideal for use in environments prone to severe shock, vibration, humidity, and extended temperature ranges. The Ampro by ADLINK™ Express-IBR is a COM Express Type 6 module that supports the quad-core and dual-core 3rd generation Intel® Core™ i7 processors and Mobile Intel® QM77 Express chipset. ADLINK Technology, Inc., a leading global provider of ruggedized embedded products, announces the release of its latest Ampro by ADLINK™ Extreme Rugged™ COM Express® module, the Express-IBR for airborne and vehicle-mounted military computers and human machine interfaces (HMI) applications required to function in harsh environments.
